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Fundings

FUNDINGS

The Chair “Advanced Technologies for Testing, Assembly and Packaging of Electronic and Photonic Integrated Circuits – EPIC-Pack” (File TSI-069100-2023-6) is funded by the Secretary of State for Telecommunications and Digital Infrastructure within the framework of the PERTE for Microelectronics and Semiconductors (PERTE Chip) and the Recovery, Transformation and Resilience Plan.

PERTE Chip fundings

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