Fundings

FUNDINGS

The Chair “Advanced Technologies for Testing, Assembly and Packaging of Electronic and Photonic Integrated Circuits – EPIC-Pack” (File TSI-069100-2023-6) is funded by the Secretary of State for Telecommunications and Digital Infrastructure within the framework of the PERTE for Microelectronics and Semiconductors (PERTE Chip) and the Recovery, Transformation and Resilience Plan.