Vision & Mision

Vision

Establish an infrastructure within the national semiconductor ecosystem for hybrid integration of chiplets, enabling to compete on a global scale within the framework of the Horizon Europe and European Space Agency funding programs, favoring national strategic autonomy in this sector.

Mision

Establishing an innovation center for hybrid integration technologies,
providing disruptive solutions that reduce the cost of assembly, packaging
and testing of photonic and electronic chiplets and elements, involving:

(Line 1) Packaging high-frequency (>100 GHz) high density interconnects,

(Line 2) Additive manufacturing, materials and adhesives for packaging, and

(Line 3) Artificial Intelligence for assembly and test